F. J. Schmückle: search on Z-Library

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1

Bulk and Grain Boundary Defects in Polycrystalline ZnO

Greuter, Felix, Blatter, G., Rossinelli, M., Schmückle, F.

Journal:

Materials Science Forum

Year:

1986

File:

PDF, 385 KB

1986

2

Flip-Chip Approach for 500 GHz Broadband Interconnects

Sinha, Siddhartha, Doerner, Ralf, Schmuckle, Franz-Josef, Monayakul, Sirinpa, Hrobak, Michael, Weimann, Nils G., Krozer, Viktor, Heinrich, Wolfgang

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2017

Language:

english

File:

PDF, 5.23 MB

english, 2017

3

[IEEE 2019 12th German Microwave Conference (GeMiC) - Stuttgart, Germany (2019.3.25-2019.3.27)] 2019 12th German Microwave Conference (GeMiC) - Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards

Phung, G. N., Schmuckle, F. J., Doerner, R., Fritzsch, T., Schulz, S., Heinrich, W.

Year:

2019

Language:

english

File:

PDF, 1.61 MB

english, 2019

4

The method of lines for the analysis of rectangular spiral inductors [in MMICs]

Schmuckle, F.J.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1993

Language:

english

File:

PDF, 327 KB

english, 1993

5

Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Zoschke, Kai, Wolf, M. JÜrgen, Topper, Michael, Ehrmann, Oswin, Fritzsch, Thomas, Kaletta, Katrin, Schmuckle, Franz-Josef, Reichl, Herbert

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.18 MB

english, 2007

6

[IEEE 2001 IEEE MTT-S International Microwave Symposium Digest - Phoenix, AZ, USA (20-25 May 2001)] 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157) - LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects

Schmuckle, F.J., Jentzsch, A., Heinrich, W., Butz, J., Spinnler, M.

Year:

2001

Language:

english

File:

PDF, 336 KB

english, 2001

7

Correction of picosecond voltage pulses measured with external electro-optic sampling tips

S. Seitz, M. Bieler, G. Hein, K. Pierz, U. Siegner, F. J. Schmückle, W. Heinrich

Year:

2007

Language:

english

File:

PDF, 440 KB

english, 2007

8

Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

Weimann, Nils G., Monayakul, Sirinpa, Sinha, Siddhartha, Schmuckle, Franz-Josef, Hrobak, Michael, Stoppel, Dimitri, John, Wilfred, Kruger, Olaf, Doerner, Ralf, Janke, Bernd, Krozer, Viktor, Heinrich,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 4.79 MB

english, 2017

9

Diffraction and microscopy studies of the atomic structure of grain boundaries

P. Lamarre, F. Schmückle, K. Sickafus, S.L. Sass

Journal:

Ultramicroscopy

Year:

1984

Language:

english

File:

PDF, 1.96 MB

english, 1984

10

Grade 3/4 Dermatitis in Head and Neck Cancer Patients Treated With Concurrent Cetuximab and IMRT

Gabriela Studer, Michelle Brown, Eveline Barata Salgueiro, Hildegard Schmückle, Natalie Romancuk, Gisela Winkler, Soon Jae Lee, Ariane Sträuli, Beatrix Kissling, Reinhard Dummer, Christoph Glanzmann

Journal:

International Journal of Radiation Oncology*Biology*Physics

Year:

2011

Language:

english

File:

PDF, 418 KB

english, 2011

11

Microbial desulfonation of multisubstituted naphthalene sulfonic acids

A. M. Cook, A. Schmuckle, T. Leisinger

Journal:

Cellular and Molecular Life Sciences

Year:

1986

Language:

english

File:

PDF, 267 KB

english, 1986

12

The method of lines for the analysis of lossy planar waveguides

Schmuckle, F.J., Pregla, R.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1990

Language:

english

File:

PDF, 557 KB

english, 1990

13

The method of lines for the analysis of planar waveguides with finite metallization thickness

Schmuckle, F.J., Pregla, R.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1991

Language:

english

File:

PDF, 369 KB

english, 1991

14

Finite-difference formulation accounting for field singularities

Zscheile, H., Schmuckles, F.J., Heinrich, W.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2006

Language:

english

File:

PDF, 713 KB

english, 2006

15

Coplanar passive elements on Si substrate for frequencies up to 110 GHz

Heinrich, W., Gerdes, J., Schmuckle, F.J., Rheinfelder, C., Strohm, K.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1998

Language:

english

File:

PDF, 107 KB

english, 1998

16

Simulation of RF Power Distribution in a Packaged GaN Power Transistor Using an Electro-Thermal Large-Signal Description

Schnieder, Frank, Bengtsson, Olof, Schmuckle, Franz-Josef, Rudolph, Matthias, Heinrich, Wolfgang

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2013

Language:

english

File:

PDF, 1.10 MB

english, 2013

17

[IEEE IEEE MTT-S International Microwave Symposium Digest, 2005. - Long Beach, CA, USA (12-17 June 2005)] IEEE MTT-S International Microwave Symposium Digest, 2005. - W-band flip-chip VCO in thin-film environment

Schmuckle, F.J., Lenk, F., Hutter, M., Klein, M., Oppermann, H., Engelmann, G., Topper, M., Riepe, K., Heinrich, W.

Year:

2005

Language:

english

File:

PDF, 441 KB

english, 2005

18

Three-dimensional InP-DHBT on SiGe-BiCMOS integration by means of Benzocyclobutene based wafer bonding for MM-wave circuits

Ostermay, I., Thies, A., Kraemer, T., John, W., Weimann, N., Schmückle, F.-J., Sinha, S., Krozer, V., Heinrich, W., Lisker, M., Tillack, B., Krüger, O.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.83 MB

english, 2014

19

[IEEE IEEE MTT-S International Microwave Symposium - IMS 2003 - Philadelphia, PA, USA (8-13 June 2003)] IEEE MTT-S International Microwave Symposium Digest, 2003 - 3D silicon micromachined RF resonators

Strohm, K.M., Schmuckle, F.J., Yaglioglu, O., Luy, J.-F., Heinrich, W.

Year:

2003

Language:

english

File:

PDF, 364 KB

english, 2003

20

[IEEE 2007 IEEE/MTT-S International Microwave Symposium - Honolulu, HI, USA (2007.06.3-2007.06.8)] 2007 IEEE/MTT-S International Microwave Symposium - A 30-GHz Waveguide-to-Microstrip-Transition

Schmuckle, F.J., Gross, W., Hirche, K., Rostewitz, M., Heinrich, Wolfgang

Year:

2007

Language:

english

File:

PDF, 1.85 MB

english, 2007

21

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - The advantage of thin film technique in the application of spiral inductors and couplers [MCM]

Wolf, J., Schmuckle, F.J., Petter, D., Kasap, T., Heinrich, W., Reichl, H.

Year:

2001

Language:

english

File:

PDF, 398 KB

english, 2001

22

[IEEE 26th European Microwave Conference, 1996 - Prague, Czech Republic (1996.10.4-1996.10.6)] 26th European Microwave Conference, 1996 - Modelling of coplanar waveguide elements for 77-GHz - MMICs

Gerdes, J., Schmuckle, F.-J., Rheinfelder, C., Heinrich, W.

Year:

1996

Language:

english

File:

PDF, 4.63 MB

english, 1996

23

[IEEE 2007 European Microwave Conference - Munich, Germany (2007.10.9-2007.10.12)] 2007 European Microwave Conference - Feeding structures for packaged multifinger power transistors

Breitkreutz, B., Schmuckle, F. J., Heinrich, W.

Year:

2007

Language:

english

File:

PDF, 533 KB

english, 2007

24

[IEEE 1992 IEEE Microwave Symposium Digest MTT-S - Albuquerque, NM, USA (1-5 June 1992)] 1992 IEEE Microwave Symposium Digest MTT-S - The method of lines for the rigorous full wave analysis of rectangular bends of multiple-line-systems

Schmuckle, F.J., Pregla, R.

Year:

1992

Language:

english

File:

PDF, 298 KB

english, 1992

25

[IEEE 2013 6th UK, Europe, China Millimeter Waves and THz Technology Workshop (UCMMT) - Rome, Italy (2013.09.9-2013.09.11)] 2013 6th UK, Europe, China Millimeter Waves and THz Technology Workshop (UCMMT) - InP on BiCMOS technology platform for millimeter-wave and THz MMIC

Krozer, V., Jensen, T., Kramer, T., Ostermay, I., Weimann, N., Schmuckle, F. J., Kruger, O., Heinrich, W., Lisker, M., Elkhouly, M., Glisic, S., Tillack, B., Meliani, C.

Year:

2013

Language:

english

File:

PDF, 1010 KB

english, 2013

26

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Stackable Thin Film Multi Layer Substrates with Integrated Passive Components

Kai Zoschke,, Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., Jordan, R., Reichl, H., Schmuckle, F.

Year:

2006

Language:

english

File:

PDF, 1.70 MB

english, 2006

27

A coplanar 38-GHz SiGe MMIC oscillator

Rheinfelder, C.N., Beisswanger, F., Gerdes, J., Schmuckle, F.J., Strohm, K.M., Luy, J.F., Heinrich, W.

Journal:

IEEE Microwave and Guided Wave Letters

Year:

1996

Language:

english

File:

PDF, 379 KB

english, 1996

28

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Thin film integration of passives - single components, filters, integrated passive devices

Zoschke, K., Wolf, J., Topper, M., Ehrmann, O., Fritzsch, T., Scherpinski, K., Reichl, H., Schmuckle, F.-J.

Year:

2004

Language:

english

File:

PDF, 1.05 MB

english, 2004

29

[IEEE 1995 IEEE MTT-S International Microwave Symposium - Orlando, FL, USA (16-20 May 1995)] Proceedings of 1995 IEEE MTT-S International Microwave Symposium - Modelling of passive elements for coplanar SiGe MMIC's

Doerner, R., Gerdes, J., Rheinfelder, C., Schmuckle, F.J., Heinrich, W., Strohm, K., Schaffler, F., Luy, J.-F.

Year:

1995

Language:

english

File:

PDF, 305 KB

english, 1995

30

Crosstalk Corrections for Coplanar-Waveguide Scattering-Parameter Calibrations

Williams, Dylan F., Schmuckle, Franz-Josef, Doerner, Ralf, Phung, Gia Ngoc, Arz, Uwe, Heinrich, Wolfgang

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2014

Language:

english

File:

PDF, 3.13 MB

english, 2014

31

[IEEE 2006 IEEE MTT-S International Microwave Symposium Digest - San Francisco, CA (2006.06.11-2006.06.16)] 2006 IEEE MTT-S International Microwave Symposium Digest - A 24 GHz Active Antenna in Flip-Chip Technology with Integrated Frontend

Talukder, Prodyut, Neuner, Marko, Meliani, Chafik, Schmuckle, Franz, Heinrich, Wolfgang

Year:

2006

Language:

english

File:

PDF, 3.98 MB

english, 2006

32

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Fabrication of application specific integrated passive devices using wafer level packaging technologies

Zoschke, K., Wolf, J., Topper, M., Ehrmann, O., Fritzsch, T., Scherpinski, K., Reichl, H., Schmuckle, F.-J.

Year:

2005

Language:

english

File:

PDF, 1.22 MB

english, 2005

33

[IEEE IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers - San Francisco, CA, USA (16-18 June 1996)] IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers - 26 GHz coplanar SiGe MMICs

Rheinfelder, C., Strohm, K., Beisswanger, F., Gerdes, J., Schmuckle, F.J., Luy, J.-F., Heinrich, W.

Year:

1996

Language:

english

File:

PDF, 354 KB

english, 1996

34

[IEEE 2007 IEEE/MTT-S International Microwave Symposium - Honolulu, HI, USA (2007.06.3-2007.06.8)] 2007 IEEE/MTT-S International Microwave Symposium - Optimizing the FDFD Method in Order to Minimize PML-Related Numerical Problems

Talukder, Prodyut K., Schmuckle, Franz-Josef, Schlundt, Reiner, Heinrich, Wolfgang

Year:

2007

Language:

english

File:

PDF, 1.65 MB

english, 2007

35

[IEEE 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010 - Anaheim, CA, USA (2010.05.23-2010.05.28)] 2010 IEEE MTT-S International Microwave Symposium - A 77 GHz broadband flip-chip transition on LTCC submount

Schmuckle, F.J., Pursche, U., Heinrich, W., Purden, Joe

Year:

2010

Language:

english

File:

PDF, 1.46 MB

english, 2010

36

[IEEE 32nd European Microwave Conference, 2002 - Milan, Italy (2002.10.4-2002.10.6)] 32nd European Microwave Conference, 2002 - Silicon Micromachined CPW Transmission Lines

Strohm, Karl M., Schmuckle, Franz Josef, Schauwecker, Bernd, Heinrich, Wolfgang, Luy, Johann-Friedrich

Year:

2002

Language:

english

File:

PDF, 3.95 MB

english, 2002

37

[IEEE 2002 International Microwave Symposium (MTT 2002) - Seattle, WA, USA (2-7 June 2002)] 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) - W-band flip-chip interconnects on thin-film substrate

Schmuckle, F.J., Jentzsch, A., Oppermann, H., Riepe, K., Heinrich, W.

Year:

2002

Language:

english

File:

PDF, 365 KB

english, 2002

38

InP-Si BiCMOS Heterointegration Using a Substrate Transfer Process

Lisker, M., Trusch, A., Kruger, A., Fraschke, M., Kulse, P., Borokhovych, Y., Tillack, B., Ostermay, I., Kramer, T., Thies, A., Kruger, O., Schmuckle, F.- J., Krozer, V., Heinrich, W.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

39

InP-Si BiCMOS Heterointegration Using a Substrate Transfer Process

Lisker, M., Trusch, A., Kruger, A., Fraschke, M., Kulse, P., Borokhovych, Y., Tillack, B., Ostermay, I., Kramer, T., Thies, A., Kruger, O., Schmuckle, F.-J., Krozer, V., Heinrich, W.

Journal:

ECS Transactions

Year:

2013

Language:

english

File:

PDF, 7.12 MB

english, 2013

40

Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

Böck, J., Wojnowski, M., Wagner, C., Knapp, H., Hartner, W., Treml, M., Schmückle, F. J., Sinha, S., Lachner, R.

Journal:

International Journal of Microwave and Wireless Technologies

Year:

2013

Language:

english

File:

PDF, 875 KB

english, 2013

41

Methyl Chloride: Naturally Occurring Toxicant and C-1 Growth Substrate

Hartmans, S., Schmuckle, A., Cook, A. M., Leisinger, T.

Journal:

Microbiology (Society for General Microbiology)

Year:

1986

Language:

english

File:

PDF, 619 KB

english, 1986

42

Degradation of Eighteen 1-Monohaloalkanes by Arthrobacter sp. Strain HA1

Scholtz, R., Schmuckle, A., Cook, A. M., Leisinger, T.

Journal:

Microbiology (Society for General Microbiology)

Year:

1987

Language:

english

File:

PDF, 897 KB

english, 1987

43

Crisis Management in the Alliance

Schmückle, Gerd

Journal:

The Washington Quarterly

Year:

1983

Language:

english

File:

PDF, 706 KB

english, 1983

44

[IEEE 2014 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM - Coronado, CA, USA (2014.9.28-2014.10.1)] 2014 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) - On-wafer small-signal and large-signal measurements up to sub-THz frequencies

Krozer, Viktor, Doerner, Ralf, Schmuckle, Franz-Josef, Weimann, Nils, Heinrich, Wolfgang, Rumiantsev, Andrej, Lisker, Marco, Tillack, Bernd

Year:

2014

Language:

english

File:

PDF, 2.31 MB

english, 2014

45

Mikrostrukturierte HF-Leitungs- und -Resonatorstrukturen

Strohm, Kart M., Schmückle, Franz Josef, Schauwecker, Bernd, Heinrich, Wolfgang, Luy, Johann-Friedrich

Journal:

Year:

2003

Language:

german

File:

PDF, 3.90 MB

german, 2003

46

Numerical Field Simulation Used to Develop High Bit-Rate Coaxial-to-CPW-Interconnects

Schmückle, F. J.

Journal:

Year:

2005

Language:

english

File:

PDF, 234 KB

english, 2005

47

Coplanar Ka-band SiGe-MMIC amplifier

Strohm, K.M., Rheinfelder, C., Luy, J.-F., Doerner, R., Schäffler, F., Gerdes, J., Jorke, H., Schmückle, F.J., Kibbel, H., Heinrich, W.

Journal:

Electronics Letters

Year:

1995

File:

PDF, 248 KB

1995

48

Psychological Well-Being von hochsensiblen Personen im Übergang zur Elternschaft – eine Querschnittstudie

Schmückle, M., Lindert, J., Schmolz, G.

Journal:

Das Gesundheitswesen

Year:

2015

Language:

german

File:

PDF, 285 KB

german, 2015

49

[IEEE 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2015.10.25-2015.10.28)] 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) - Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly

Monayakul, S., Sinha, S., Schmuckle, F. J., Hrobak, M., Stoppel, D., Kruger, O., Janke, B., Weimann, N. G.

Year:

2015

Language:

english

File:

PDF, 600 KB

english, 2015

50

[IEEE 2002 International Microwave Symposium (MTT 2002) - Seattle, WA, USA (2-7 June 2002)] 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) - Silicon micromachined RF MEMS resonators

Strohm, K.M., Schmuckle, F.J., Schauwecker, B., Luy, J.-F., Heinrich, W.

Year:

2002

File:

PDF, 259 KB

2002

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